Helping to bring connectivity that’s lacking in existing systems, the AEC-Q100 grade-3-qualified parts support the new Ethernet AVB specification.
By Murray Slovick, Contributing Editor
More and more road vehicles now have on-board connectivity. It equips them with internet and cellular access, and allows information to be shared among on-board systems and devices and with external systems and services.
These developments all require more complex automotive communication systems supported by reliable transmission standards with real-time data delivery. For ADAS and autonomous-driving technologies in particular, low-latency communications is essential. New standards, such as Ethernet AVB, are becoming adopted in automotive applications to meet these increased performance requirements.
But because connectivity standards differ among devices such as displays, an interface gap problem between peripheral devices and systems-on-chip (SoCs) can arise, particularly as existing SoCs may lack the interfaces required for automotive networks.
Interface bridge ICs can help to solve this problem, which prompted Toshiba America Electronic Components to develop the latest members of its automotive network bridge IC product line—the TC9562 series. The chips provide Ethernet capability for telematics and infotainment systems. Connected to an application processor or other SoC host, the devices allow it to deliver audio, video, and data through the Ethernet network in an automotive environment.
The first parts in the series, which offer more interfaces than Toshiba’s current bridge ICs, are the TC9562BXBG, which supports Ethernet TSN and Ethernet AVB and TC9562XBG, which offers a simpler IC configuration than current products.
According to Toshiba, the TC9562 can deliver Ethernet bridging capability of up to 1-Gbit/s bandwidth. The new automotive bridge IC also supports the Time-Sensitive Networking (TSN) protocol for various industrial and commercial applications.
The TC9562 series specifically supports IEEE 802.1AS and IEEE 802.1Qav, as well as TSN standards IEEE 802.1Qbv, IEEE 802.1Qbu, and IEEE 802.3br. The New IC further supports a range of interfaces including PCI Express 2.0 and 1.0, I2S/TDM, RGMII, RMII, MII, and an option for SGMII for expanded interfaces to various IVI SoC solutions.
Toshiba also is targeting a low-power mode for the TC9562 series of 0.5-mW power consumption and a 100-ms recovery time (typical). The devices are packaged in a P-LFBGA120 9- × 9-mm package. Sample shipments will start this month, and volume production will start in October 2019.