Samsung’s latest 256 Gbyte eUFS flash memory chip handles rugged, automotive environments.
By William Wong, Technical Editor
Samsung Electronics is now mass-producing its 256-Gbyte embedded Universal Flash Storage (eUFS) solution. It meets the automotive specifications from the JEDEC UFS 3.0 standard. This allows it to be used in next-generation infotainment systems, Advanced Driver Assistance Systems (ADAS), and in the latest high-tech dashboards found in luxury vehicles.
One of its key features is the thermal management support. This is critical automotive memory applications where the temperature range is −40°C and 105°C. Most embedded multimedia card (eMMC) 5.1 solutions handle a range of −25°C to 85°C.
“With the new temperature threshold for automobile warranties, major automotive manufacturers can now design-in memory that’s even well-suited for extreme environments, and know they will be getting highly reliable performance,” said Kyoung Hwan Han, Samsung’s vice president of NAND marketing. “Starting with high-end vehicles, we expect to expand our business portfolio across the entire automotive market, while accelerating growth in the premium memory segment.”
The new 256 Gbyte eUFS not only handles the wider temperature range, but also includes a temperature notification feature. This allows the system to detect when a predefined temperature is exceeded so the system can reduce the clock and overall performance to maintain accurate memory contents. The temperature notification was developed by Samsung. Along with a data refresh feature, it is part of the JEDEC UFS 3.0 specification. The data refresh feature enables greater system reliability by relocating older data to other less-used cells.
The chip can deliver sequential reads at 850 Mbytes/s, which is at the high end of the current JEDEC UFS 2.1 standard. It also delivers random read operations of 45,000 IOPS.