By Julien Happich, Contributing Technical Editor
According to a report from Korean IT newsmedia etnews, Samsung Electronics is planning to release application processors specifically aimed at car OEMs, potentially competing with established automotive chip providers such as NXP, Renesas, and Infineon but also with newcomers in the automotive space such as Intel and Qualcomm.
Leveraging its unique competitive edge in smartphone chip design and production, Samsung could make the competition intensify, notes the report, adding that the company’s System large-scale integration (LSI) Business Department in its Device Solution Division is developing an automotive application processor dubbed “Exynos Auto” for which it could establish a mass-production facility by the end of 2018.
The new chip would target major customers such as Audi and Harman, the latter being a subsidiary of Samsung.
According to the report, Exynos Auto would be used mostly for infotainment systems, digital dashboards, and HUDs (Head-Up Display) and in this respect, it is being developed with the aim to satisfy ASIL (Automotive Safety Integrity Level) B out of ISO 26262, an international standard for safety of automotive features.
Samsung’s System large-scale integration (LSI) Business Department once supplied Smartphone APs to Audi in January of 2017 after modifying them, reports etnews, and Exynos Auto’s operation conditions, safety, and production maintenance period would be developed solely for cars.
Early generations of Exynos Auto will be the first Samsung APs to have a Neural Processing Unit (NPU) block to artificial intelligence-based algorithms for signal analysis from different sensors around the car, adds the report. The new AP could be used in ADAS (Advanced Driver Assistance Systems) to recognize lanes and obstacles more efficiently. The Exynos Auto is also expected to have an LTE modem for cloud connectivity.
If so, Samsung Electronics would be likely to compete with Qualcomm, trying to displace its chips from Audi’s cars in which they are being designed.
This article originally appeared on eenewseurope. It is published here with permission.